Application of circuit board chip-level repairing on the maintenance of X-ray fluorescence spectrometer

WANG Ming-li, MIAO Ming-jun, LIU Ping, ZHANG Guang-zhi, WANG Gui-yu, XIA Bi-feng

Metallurgical Analysis ›› 2019, Vol. 39 ›› Issue (4) : 70-74.

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Metallurgical Analysis ›› 2019, Vol. 39 ›› Issue (4) : 70-74. DOI: 10.13228/j.boyuan.issn1000-7571.010514

Application of circuit board chip-level repairing on the maintenance of X-ray fluorescence spectrometer

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 39(4): 70-74 https://doi.org/10.13228/j.boyuan.issn1000-7571.010514

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