Abstract：Through using nitric-sulfuric acid as electrolyte and controlling the electrolytic current at 2 A, nineteen trace impurities (Mg, Bi, Al, P, Ti, Cr, Mn, Fe, Zn, Co, Ni, As, Se, Zr, Cd, Sn, Sb, Te and Pb）in pure copper were determined with a combination of electrochemical deposition separation and inductively coupled plasma atomic emission spectrometry. The results showed that more than 99% of Cu matrix was deposited on cathode with the recoveries of impurities higher than 90 % under the optimized conditions. The effects of acid and residual copper in electrolyte after electrolysis were investigated. It indicated that the matrix effect which was not obvious could be further eliminated by matrix matching. The detection limits of these elements were in the range of 0.02-4 mg/kg. The method has been applied to determine pure copper reference material GBW02141 and the results were consistent with the certified values. The recovery test was conducted with high purity copper as blank. The recoveries of these elements (except Bi) were in the range of 90%-100% with relative standard deviations（RSD，n=5）of 0.2 %-7.2 %.
