Abstract：The solder samples were dissolved in hydrochloric acid and hydrogen peroxide. Then, the tin was removed by hydrochloric acid-hydrobromide in presence of little sulfuric acid, and the contents of lead and cadmium were determined by inductively coupled plasma atomic emission spectrometry (ICP-AES). The working parameters of ICP instrument were optimized.The influencing factors such as acid for dissolving sample and tin matrix were tested. The linear ranges in this method were obtained between 0.50- 5.00 μg/mL (for Pb) and 0.050-0.50 μg/mL (for Cd). The detection limits were 13.2 μg/L for Pb and 0.9 μg/L for Cd, respectively. The relative standard deviations (RSD, n=6) were less than 4 %. The recoveries rate for lead and cadmium obtained by standard addition method were 97 % -108 % and 90 %-96 % respectively.
雷宏田*，王静，毛亚蓉. 电感耦合等离子体原子发射光谱法测定Sn-Ag-Cu系焊锡中铅和镉[J]. 冶金分析, 2011, 31(5): 71-73.
LEI Hong-tian*, WANG Jing, MAO Ya-rong. Inductively coupled plasma atomic emission spectrometry determination of lead and cadmium in Sn-Ag-Cu system solders. , 2011, 31(5): 71-73.
