Application of X-ray photoelectron spectroscopy in lead-free solders
SONG Shijie1, ZHANG Lei1, TANG Mengqi2, LE Yunlin1, YANG Wenchao*1
1. State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures, MOE Key Laboratory of New Processing Technology for Nonferrous Metals and Materials,School of Resources, Environment and Materials,Guangxi University,Nanning 530004,China; 2. Nanning Customs Technology Centre,Nanning 530000,China
Abstract：Advanced surface characterization techniques play a crucial role in the investigation of lead-free solders. As a surface analysis method with high resolution and sensitivity, X-ray photoelectron spectroscopy (XPS) can accurately analyze the element type and valence states. In this paper, the application of XPS in analysis of chemical composition, oxidation, wetting, corrosion, electromigration and other properties of lead-free solders was mainly introduced. The influencing mechanisms of lead-free solders and solder joint properties were comprehensively discussed from multiple perspectives, which could provide some references for the studies of lead-free solders by XPS in future.
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