Abstract：The influence of sample preparation process of waste circuit boards of non-integrated electronics on the precision and trueness of copper content testing results was studied. Binary pairs measurement and single testing were adopted to analyze the precision of copper content testing results in experiments. The optimized preparation process including crushing, fine crushing, division, pre-drying, and grinding was proposed. The test results showed that the main factor affecting the precision of sample preparation of non-integrated electronics waste circuit boards was the sieving rate of 0.15 mm (100-mesh). The best preparation effect could be reached by two-stage crushing combination, i.e., crushing by double roll cutter shear crusher and fine crushing by slice hammer smasher. By increasing the rotate speed of the vibrating disc-mill machine to 1 200 r/min, prolonging the grinding time to 180 s, and adopting the pre-drying process for sample before grinding, the phenomenon of "weak agglomerate" after grinding and sieving of non-integrated electronics waste circuit board could be effectively reduced. The sieving rate of 100-mesh was increased to 98%, thus improving the sample preparation precision. The optimized preparation process had good precision and trueness, which could meet the testing requirements of copper content in waste circuit boards of non-integrated electronics.
朱明伟, 李翔, 刘宇. 非集成电子器件废旧电路板制样对铜含量检测结果的影响[J]. 冶金分析, 2023, 43(5): 61-66.
ZHU Mingwei, LI Xiang, LIU Yu. Influence of sample preparation method on determination result of copper content in waste circuit board of non-integrated electronics. , 2023, 43(5): 61-66.
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