Abstract：The impurity elements in tin-lead solder had an important influence on the oxidation resistance, wettability and expansion area of solder joints. Therefore, the accurate determination of these impurities was of great significance. The sample was dissolved with nitric acid and hydrofluoric acid. The content of Fe was determined at H2 dynamic reaction cell mode, and the contents of Al, P, Cu, Zn, As, Cd, Ag, Sb, Au and Bi were determined at standard mode. Meanwhile, Sc was selected for the correction of Al, P, Fe and Cu; Cs was selected for the correction of Zn, As, Ag and Cd; Tl was selected for the correction of Sb, Au and Bi. Thus, a determination of eleven impurity elements in tin-lead solder by inductively coupled plasma mass spectrometry (ICP-MS) was realized. Under the optimized experimental conditions, the correlation coefficients of calibration curves of 11 impurity elements were all higher than 0.999. The detection limits were in the range of 0.002-0.80μg/g, and the low limit of determination were in the range of 0.007-2.73μg/g. The proposed method was applied for the determination of Al, P, Fe, Cu, Zn, As, Cd, Ag, Sb, Au and Bi in tin-lead solder sample. The relative standard deviations (RSDs, n=11) were between 0.85% and 3.5%, and the recoveries were between 90% and 110%. The experimental method was also applied for the determination of seven impurity elements (Al, Fe, Cu, Zn, As, Sb and Bi) in the certified reference material of tin-lead solder. The results were consistent with the certified values.
墨淑敏, 李娜, 王长华, 邱长丹, 潘元海, 杨飞宇. 电感耦合等离子体质谱法测定锡铅焊料中11种杂质元素[J]. 冶金分析, 2019, 39(9): 21-25.
MO Shu-min, LI Na, WANG Chang-hua, QIU Chang-dan, PAN Yuan-hai, YANG Fei-yu. Determination of eleven impurities in tin-lead solder byinductively coupled plasma mass spectrometry. , 2019, 39(9): 21-25.
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